李伟杰, 李小龙. 温度交变环境下防热结构胶层厚度设计[J]. 航天器环境工程, 2013, 30(4): 421-425
引用本文: 李伟杰, 李小龙. 温度交变环境下防热结构胶层厚度设计[J]. 航天器环境工程, 2013, 30(4): 421-425
Li Weijie, Li Xiaolong. Design of bond-layer thickess of thermal protection gbllcture under altemating temperature condition[J]. Spacecraft Environment Engineering, 2013, 30(4): 421-425.
Citation: Li Weijie, Li Xiaolong. Design of bond-layer thickess of thermal protection gbllcture under altemating temperature condition[J]. Spacecraft Environment Engineering, 2013, 30(4): 421-425.

温度交变环境下防热结构胶层厚度设计

Design of bond-layer thickess of thermal protection gbllcture under altemating temperature condition

  • 摘要: 再入返回式航天器飞行过程中,在轨温度交变环境下防热结构胶接热应力一直是航天器可靠性设计的关注內容恼乱浴爸忻芏确廊炔牧?硅橡胶-金属“”的胶接结构作为对象,针对典型的低地球轨道温度交变环境,选取±100℃/5个循环环境作为分析条件,用ANSYSWorkbench建立了结构有限元分析模型,考察了不同胶层厚度对于结构热应力及热变形的影响。基于有限元计算结果、热应力理论及胶接工艺分析,给出了温度交变环境下防热结构的胶层厚度设计结果.该有限元模型分析方法可为防热结构热匹配特性研究和设计提供基础依据。

     

    Abstract: The themal stress in a themal protection strIJcture(TPS)in the reentry spacecraft under the altemating in. orbit temperature condition during night is always an imponant issue. This paper investigates the bonded stmcture of“mid-density shield-silicon. metal"under ±100℃/5 cycles based on the typical themal condition of the low. eanh-orbit. Innuences of the bond-layer thickness on the themal stress and defomation are obtained by the finite elemem analysis(FEA)model based on ANsYs soware. nle optimal TPs bond-layer thickness is obtained for the application in the present themal condition according to the analysis of the FEA results, the themal stress theory and the bond processing. The FEA simulation results can be used for TPS themal-match property study and design.

     

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