张峻, 孙晓峰, 张彬彬, 等. 极限温度环境对电子材料及元器件性能的影响[J]. 航天器环境工程, 2018, 35(6): 1-1 DOI: 10.12126/see.2018.06.007
引用本文: 张峻, 孙晓峰, 张彬彬, 等. 极限温度环境对电子材料及元器件性能的影响[J]. 航天器环境工程, 2018, 35(6): 1-1 DOI: 10.12126/see.2018.06.007
ZHANG J, SUN X F, ZHANG B B, et al. Effects of extreme temperature on electronic material and components performance in deep space[J]. Spacecraft Environment Engineering, 2018, 35(6): 1-1 DOI: 10.12126/see.2018.06.007
Citation: ZHANG J, SUN X F, ZHANG B B, et al. Effects of extreme temperature on electronic material and components performance in deep space[J]. Spacecraft Environment Engineering, 2018, 35(6): 1-1 DOI: 10.12126/see.2018.06.007

极限温度环境对电子材料及元器件性能的影响

Effects of extreme temperature on the performance of electronic materials and components in deep space

  • 摘要: 文章对深空探测航天器所处的极限温度环境进行说明,综合介绍了国外在此相关领域的研究进展,并从力学性能和微观组织2方面对钎料在极限低温下的变化规律进行阐述,继而扩展至器件级别,对各种器件在极限低温环境下的性能进行研究和总结。

     

    Abstract: The deep space exploration spacecraft might encounter an extreme temperature environment. This paper first discusses the severe thermal environment and the research progress of related institutes in the world. The mechanical properties and the microstructure evolution of solder in the extreme temperatures are analyzed, as well as the performance of various common-used electronic components under extreme temperatures.

     

/

返回文章
返回