徐增光, 彭毅, 焦会馨. 仿叶脉均热板的传热性能实验研究[J]. 航天器环境工程, 2023, 40(3): 226-232 DOI: 10.12126/see.2023001
引用本文: 徐增光, 彭毅, 焦会馨. 仿叶脉均热板的传热性能实验研究[J]. 航天器环境工程, 2023, 40(3): 226-232 DOI: 10.12126/see.2023001
XU Z G, PENG Y, JIAO H X. Experimental study on heat transfer performance of bionic vein vapor chamber[J]. Spacecraft Environment Engineering, 2023, 40(3): 226-232 DOI: 10.12126/see.2023001
Citation: XU Z G, PENG Y, JIAO H X. Experimental study on heat transfer performance of bionic vein vapor chamber[J]. Spacecraft Environment Engineering, 2023, 40(3): 226-232 DOI: 10.12126/see.2023001

仿叶脉均热板的传热性能实验研究

Experimental study on heat transfer performance of bionic vein vapor chamber

  • 摘要: 均热板作为一种高效散热元件已广泛应用于电子器件的热管理,其吸液芯的结构形式是均热板进行高效散热的关键。文章受自然界植物叶片蒸腾作用的启发,通过粉末烧结形成多孔结构的吸液芯以模仿植物叶脉及叶肉组织,设计了以多边形的边(VC-B)和以多边形(VC-G)作为均热板内部支撑两种吸液芯结构进行对比研究,并探究充液率以及冷却水温度对均热板传热性能的影响规律。研究表明:VC-B均热板在充液率为60%左右时具有最优的传热性能,所能承载的最大热流密度为120 W/cm2;VC-G均热板在冷却水温度为10 ℃时所能承载的最大热流密度为130 W/cm2;在较低的冷却水温度下,均热板的传热能力较强,但均温性较差。仿叶脉均热板可为大功率、高热流密度电子设备的散热提供有效的解决途径。

     

    Abstract: Vapor chamber, as an efficient heat dissipation component, has been widely used in the thermal management of electronic devices. The structure of its liquid absorbing wick is the key to efficient heat dissipation of vapor chamber. In this study, inspired by the transpiration of plant leaves in nature, the porous wick was made by powder sintering to imitate the leaf veins and mesophyll tissues. Two wick structures with polygonal edge (VC-B) and polygonal (VC-G) as internal support of vapor chambers were designed for comparative research to investigate the influence of liquid filling rate and cooling water temperature on the heat transfer performance. The results show that the VC-B vapor chamber has the optimal heat transfer performance with a filling rate of 60%, and a maximum bearable heat flux of 120 W/cm2, while that VC-G vapor chamber can bear 130 W/cm2 at a cooling water temperature of 10 ℃. At lower cooling water temperatures, the heat transfer capacity was strong, but the temperature uniformity was poor. These bionic vein vapor chambers may provide an effective solution for heat dissipation of electronic devices with high power and high heat flux.

     

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